State Intellectual Property Office of China Publishes Univ Shandong's Patent Application for Simulation Method and System for Press-Fit Forming Process of Printed Circuit Board

  • Bin Zhang

Press/Media: Press / Media

PeriodDec 7 2022

Media coverage

1

Media coverage

  • TitleState Intellectual Property Office of China Publishes Univ Shandong's Patent Application for Simulation Method and System for Press-Fit Forming Process of Printed Circuit Board
    Media name/outletGlobal IP News. Electronics Patent News
    Country/TerritoryIndia
    Date12/7/22
    PersonsBin Zhang