US Patent Issued to Tsinghua University, HON HAI PRECISION INDUSTRY on Nov. 24 for "Method for making nanoporous copper" (Chinese Inventors)

  • Zhen Li

Press/Media: Press / Media

PeriodNov 25 2020

Media coverage

1

Media coverage

  • TitleUS Patent Issued to Tsinghua University, HON HAI PRECISION INDUSTRY on Nov. 24 for "Method for making nanoporous copper" (Chinese Inventors)
    Media name/outletUS Fed News
    Country/TerritoryUnited States
    Date11/25/20
    PersonsZhen Li
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