US Patent Issued to Tsinghua University, HON HAI PRECISION INDUSTRY on Jan. 18 for "Porous copper composite and method thereof" (Chinese Inventors)

  • Zhen Li

Press/Media: Press / Media

PeriodJan 19 2022

Media coverage

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Media coverage

  • TitleUS Patent Issued to Tsinghua University, HON HAI PRECISION INDUSTRY on Jan. 18 for "Porous copper composite and method thereof" (Chinese Inventors)
    Media name/outletUS Fed News
    Country/TerritoryUnited States
    Date01/19/22
    PersonsZhen Li
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