US Patent Issued to Tsinghua University, HON HAI PRECISION INDUSTRY on May 30 for "Three-dimensional hierarchical layered porous copper and method for making the same" (Chinese Inventors)

Press/Media: Press / Media

Period	May 31 2023

Media coverage

Title	US Patent Issued to Tsinghua University, HON HAI PRECISION INDUSTRY on May 30 for "Three-dimensional hierarchical layered porous copper and method for making the same" (Chinese Inventors)
Media name/outlet	US Fed News
Country/Territory	United States
Date	05/31/23
URL	metabase.moreover.com/noarticleurl?type=psh&lni=68C2-GW81-F12F-F2D5-00000-00
Persons	Zhen Li