US Patent Issued to Tsinghua University, HON HAI PRECISION INDUSTRY on May 30 for "Three-dimensional hierarchical layered porous copper and method for making the same" (Chinese Inventors)

  • Zhen Li

Press/Media: Press / Media

PeriodMay 31 2023

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  • TitleUS Patent Issued to Tsinghua University, HON HAI PRECISION INDUSTRY on May 30 for "Three-dimensional hierarchical layered porous copper and method for making the same" (Chinese Inventors)
    Media name/outletUS Fed News
    Country/TerritoryUnited States
    Date05/31/23
    URLct.moreover.com/?a=50929039828&p=1gw&v=1&x=jDdqz-fFjhJ_sFv9n40PKQ
    PersonsZhen Li
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