3D Coin Integration for Realizing Next-Generation Flexible Electronic Systems

Sohail F. Shaikh; Nadeem Qaiser; Muhammad Mustafa Hussain

doi:10.1109/IITC47697.2020.9515600

3D Coin Integration for Realizing Next-Generation Flexible Electronic Systems

Sohail F. Shaikh, Nadeem Qaiser, Muhammad Mustafa Hussain

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

2 Scopus citations

Abstract

We present CMOS-compatible 3D coin architecture interconnect technology for enabling manufacturable heterogeneously integrated physically compliant electronic systems (< 1 mm bending radius). The interconnect technology along with the integration scheme shall maximize the area efficiency by having sensors on one side of the soft-polymeric platform (one side of coin) and other data processing, storage, and energy (solid-state battery) sandwiched within the polymeric encapsulation. Other side of the coin is used for RF/communication and energy harvesting module. Such an architecture will be an enabling factor in realization of truly flexible electronic platforms for IoT and implantable applications of next generation.

Original language	English (US)
Title of host publication	2020 IEEE International Interconnect Technology Conference (IITC)
Publisher	IEEE
ISBN (Print)	978-1-7281-6114-3
DOIs	https://doi.org/10.1109/IITC47697.2020.9515600
State	Published - 2020

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10.1109/IITC47697.2020.9515600

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@inproceedings{0a5c273f4b644d71a7a44b7b5bc152fd,

title = "3D Coin Integration for Realizing Next-Generation Flexible Electronic Systems",

abstract = "We present CMOS-compatible 3D coin architecture interconnect technology for enabling manufacturable heterogeneously integrated physically compliant electronic systems (< 1 mm bending radius). The interconnect technology along with the integration scheme shall maximize the area efficiency by having sensors on one side of the soft-polymeric platform (one side of coin) and other data processing, storage, and energy (solid-state battery) sandwiched within the polymeric encapsulation. Other side of the coin is used for RF/communication and energy harvesting module. Such an architecture will be an enabling factor in realization of truly flexible electronic platforms for IoT and implantable applications of next generation.",

author = "Shaikh, {Sohail F.} and Nadeem Qaiser and Hussain, {Muhammad Mustafa}",

note = "KAUST Repository Item: Exported on 2021-09-01",

year = "2020",

doi = "10.1109/IITC47697.2020.9515600",

language = "English (US)",

isbn = "978-1-7281-6114-3",

booktitle = "2020 IEEE International Interconnect Technology Conference (IITC)",

publisher = "IEEE",

}

TY - GEN

T1 - 3D Coin Integration for Realizing Next-Generation Flexible Electronic Systems

AU - Shaikh, Sohail F.

AU - Qaiser, Nadeem

AU - Hussain, Muhammad Mustafa

N1 - KAUST Repository Item: Exported on 2021-09-01

PY - 2020

Y1 - 2020

N2 - We present CMOS-compatible 3D coin architecture interconnect technology for enabling manufacturable heterogeneously integrated physically compliant electronic systems (< 1 mm bending radius). The interconnect technology along with the integration scheme shall maximize the area efficiency by having sensors on one side of the soft-polymeric platform (one side of coin) and other data processing, storage, and energy (solid-state battery) sandwiched within the polymeric encapsulation. Other side of the coin is used for RF/communication and energy harvesting module. Such an architecture will be an enabling factor in realization of truly flexible electronic platforms for IoT and implantable applications of next generation.

AB - We present CMOS-compatible 3D coin architecture interconnect technology for enabling manufacturable heterogeneously integrated physically compliant electronic systems (< 1 mm bending radius). The interconnect technology along with the integration scheme shall maximize the area efficiency by having sensors on one side of the soft-polymeric platform (one side of coin) and other data processing, storage, and energy (solid-state battery) sandwiched within the polymeric encapsulation. Other side of the coin is used for RF/communication and energy harvesting module. Such an architecture will be an enabling factor in realization of truly flexible electronic platforms for IoT and implantable applications of next generation.

UR - http://hdl.handle.net/10754/670862

UR - https://ieeexplore.ieee.org/document/9515600/

U2 - 10.1109/IITC47697.2020.9515600

DO - 10.1109/IITC47697.2020.9515600

M3 - Conference contribution

SN - 978-1-7281-6114-3

BT - 2020 IEEE International Interconnect Technology Conference (IITC)

PB - IEEE

ER -

3D Coin Integration for Realizing Next-Generation Flexible Electronic Systems

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