3D inkjet printed disposable environmental monitoring wireless sensor node

Muhammad Fahad Farooqui, Atif Shamim

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

8 Scopus citations

Abstract

We propose a disposable, miniaturized, moveable, fully integrated 3D inkjet-printed wireless sensor node for large area environmental monitoring applications. As a proof of concept, we show the wireless sensing of temperature, humidity and H2S levels which are important for early warnings of two critical environmental conditions namely forest fires and industrial gas leaks. The temperature sensor has TCR of -0.018/°, the highest of any inkjet-printed sensor and the H2S sensor can detect as low as 3 ppm of gas. These sensors and an antenna have been realized on the walls of a 3D-printed cubic package which encloses the microelectronics developed on a 3D-printed circuit board. Hence, 3D printing and inkjet printing have been combined in order to realize a unique low-cost, fully integrated wireless sensor node. Field tests show that these sensor nodes can wirelessly communicate up to a distance of over 100m. Our proposed sensor node can be a part of internet of things with the aim of providing a better and safe living.

Original languageEnglish (US)
Title of host publication2017 IEEE MTT-S International Microwave Symposium, IMS 2017
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages1379-1382
Number of pages4
ISBN (Electronic)9781509063604
DOIs
StatePublished - Oct 4 2017
Event2017 IEEE MTT-S International Microwave Symposium, IMS 2017 - Honololu, United States
Duration: Jun 4 2017Jun 9 2017

Publication series

NameIEEE MTT-S International Microwave Symposium Digest
ISSN (Print)0149-645X

Conference

Conference2017 IEEE MTT-S International Microwave Symposium, IMS 2017
Country/TerritoryUnited States
CityHonololu
Period06/4/1706/9/17

Keywords

  • 3D printing
  • Environmental sensing
  • Inkjet printing
  • Internet-of-things (IoT)

ASJC Scopus subject areas

  • Condensed Matter Physics
  • Radiation
  • Electrical and Electronic Engineering

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