TY - GEN
T1 - A 24 GHz CMOS oscillator transmitter with an inkjet printed on-chip antenna
AU - Ghaffar, Farhan A.
AU - Yang, Shuai
AU - Cheema, Hammad M.
AU - Shamim, Atif
N1 - KAUST Repository Item: Exported on 2020-10-01
PY - 2016/8/15
Y1 - 2016/8/15
N2 - CMOS based RF circuits have demonstrated efficient performance over the decades. However, one bottle neck with this technology is its lossy nature for passive components such as inductors, antennas etc. Due to this drawback, passives are either implemented off chip or the designers work with the inefficient passives. This problem can be alleviated by using inkjet printing as a post process on CMOS chip. In this work, we demonstrate inkjet printing of a patterned polymer (SU8) layer on a 24 GHz oscillator chip to isolate the lossy Si substrate from the passives which are inkjet printed on top of the SU8 layer. As a proof of concept, a monopole antenna is printed on top of the SU8 layer integrating it with the oscillator through the exposed RF pads to realize an oscillator transmitter. The proposed hybrid fabrication technique can be extended to multiple dielectric and conductive printed layers to demonstrate complete RF systems on CMOS chips which are efficient, cost-effective and above all small in size. © 2016 IEEE.
AB - CMOS based RF circuits have demonstrated efficient performance over the decades. However, one bottle neck with this technology is its lossy nature for passive components such as inductors, antennas etc. Due to this drawback, passives are either implemented off chip or the designers work with the inefficient passives. This problem can be alleviated by using inkjet printing as a post process on CMOS chip. In this work, we demonstrate inkjet printing of a patterned polymer (SU8) layer on a 24 GHz oscillator chip to isolate the lossy Si substrate from the passives which are inkjet printed on top of the SU8 layer. As a proof of concept, a monopole antenna is printed on top of the SU8 layer integrating it with the oscillator through the exposed RF pads to realize an oscillator transmitter. The proposed hybrid fabrication technique can be extended to multiple dielectric and conductive printed layers to demonstrate complete RF systems on CMOS chips which are efficient, cost-effective and above all small in size. © 2016 IEEE.
UR - http://hdl.handle.net/10754/621296
UR - http://ieeexplore.ieee.org/document/7540081/
UR - http://www.scopus.com/inward/record.url?scp=84985011840&partnerID=8YFLogxK
U2 - 10.1109/MWSYM.2016.7540081
DO - 10.1109/MWSYM.2016.7540081
M3 - Conference contribution
SN - 9781509006984
BT - 2016 IEEE MTT-S International Microwave Symposium (IMS)
PB - Institute of Electrical and Electronics Engineers (IEEE)
ER -