A 3D-printed Cantilever Beam Within a Semi-enclosed Cylinder Cavity For Differential Pressure Sensing

Xuecui Xou*, Dhiya Belkadi, Min Sung Kim, Khaled Nabil Salama, Muhammad Mustafa Hussain

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

Abstract

In this study, a cantilever-based pressure sensor is fabricated that moves within a cylinder cavity by using a fused deposition modeling (FDM)-based three-dimensional (3D) printer. The semi-enclosed cylinder cavity frame is generated through layer-by-layer additive manufacturing to release the suspended cantilever structure by the FDM-type 3D printer. The displacement of the sensing membrane induced by the pressure difference on both sides of the membrane results in capacitance variations, which can be read out electrostatically. Furthermore, the results also highlight the simplicity and cost-effectiveness of the manufacturing process for this portable pressure sensor.

Original languageEnglish (US)
Title of host publicationIEEE Electron Devices Technology and Manufacturing Conference
Subtitle of host publicationStrengthening the Globalization in Semiconductors, EDTM 2024
PublisherInstitute of Electrical and Electronics Engineers Inc.
ISBN (Electronic)9798350371529
DOIs
StatePublished - 2024
Event8th IEEE Electron Devices Technology and Manufacturing Conference, EDTM 2024 - Bangalore, India
Duration: Mar 3 2024Mar 6 2024

Publication series

NameIEEE Electron Devices Technology and Manufacturing Conference: Strengthening the Globalization in Semiconductors, EDTM 2024

Conference

Conference8th IEEE Electron Devices Technology and Manufacturing Conference, EDTM 2024
Country/TerritoryIndia
CityBangalore
Period03/3/2403/6/24

Keywords

  • 3D-printing
  • Differential sensing
  • electrostatic
  • Pressure sensor

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Energy Engineering and Power Technology
  • Electrical and Electronic Engineering
  • Instrumentation

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