TY - GEN
T1 - A 5.2GHz, 0.5mW RF powered wireless sensor with dual on-chip antennas for implantable intraocular pressure monitoring
AU - Arsalan, Muhammad
AU - Ouda, Mahmoud H.
AU - Marnat, Loic
AU - Ahmad, Talha Jamal
AU - Shamim, Atif
AU - Salama, Khaled N.
N1 - KAUST Repository Item: Exported on 2020-10-01
PY - 2013/6
Y1 - 2013/6
N2 - For the first time a single chip implantable wireless sensor system for Intraocular Pressure Monitoring (IOPM) is presented. This system-on-chip (SoC) is battery-free and harvests energy from incoming RF signals. The chip is self-contained and does not require external components or bond wires to function. This 1.4mm3 SoC has separate 2.4GHz-transmit and 5.2GHz-receive antennas, an energy harvesting module, a temperature sensor, a 7-bit TIQ Flash ADC, a 4-bit RFID, a power management and control unit, and a VCO transmitter. The chip is fabricated in a standard 6-metal 0.18μm CMOS process and is designed to work with a post-processed MEMS pressure sensor. It consumes 513μW of peak power and when implanted inside the eye, it is designed to communicate with an external reader using on-off keying (OOK). © 2013 IEEE.
AB - For the first time a single chip implantable wireless sensor system for Intraocular Pressure Monitoring (IOPM) is presented. This system-on-chip (SoC) is battery-free and harvests energy from incoming RF signals. The chip is self-contained and does not require external components or bond wires to function. This 1.4mm3 SoC has separate 2.4GHz-transmit and 5.2GHz-receive antennas, an energy harvesting module, a temperature sensor, a 7-bit TIQ Flash ADC, a 4-bit RFID, a power management and control unit, and a VCO transmitter. The chip is fabricated in a standard 6-metal 0.18μm CMOS process and is designed to work with a post-processed MEMS pressure sensor. It consumes 513μW of peak power and when implanted inside the eye, it is designed to communicate with an external reader using on-off keying (OOK). © 2013 IEEE.
UR - http://hdl.handle.net/10754/564730
UR - http://ieeexplore.ieee.org/document/6697639/
UR - http://www.scopus.com/inward/record.url?scp=84893211834&partnerID=8YFLogxK
U2 - 10.1109/MWSYM.2013.6697639
DO - 10.1109/MWSYM.2013.6697639
M3 - Conference contribution
SN - 9781467361767
BT - 2013 IEEE MTT-S International Microwave Symposium Digest (MTT)
PB - Institute of Electrical and Electronics Engineers (IEEE)
ER -