A Highly Miniaturized 3D Antenna in Package for UHF RFID Application

Z. Lopez, Zubair Akhter, Atif Shamim

Research output: Chapter in Book/Report/Conference proceedingConference contribution


As the Internet of Things (IoT) and sensing technologies are spreading out, modern systems require wireless and real-time data transfer between devices. RFID technology is one of the most used technologies for this information exchange. For compact devices, antenna in package (AiP) concept presents an advantage in this scenario because the antenna does not need any additional space while the package protects the electronic components and sensors from the environment. In this paper, an AiP is designed and miniaturized by employing volumetric folding and dielectric loading techniques. Firstly, a dipole in free space is analyzed by folding it into a cuboid shape. Later, a free space is replaced with the dielectric as AiP body material to achieve the required miniaturization for the RFID band. The proposed AiP resonates at 891 MHz with a ka of 0.27 and exhibits a decent efficiency of 34$^{%}$.
Original languageEnglish (US)
Title of host publication2021 IEEE International Symposium on Antennas and Propagation and USNC-URSI Radio Science Meeting (APS/URSI)
ISBN (Print)978-1-7281-4671-3
StatePublished - 2021


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