TY - GEN
T1 - A novel hybrid 2D/Q-2D finite element method for power/ground plane analysis
AU - Li, Ping
AU - Jiang, Li Jun
AU - Bagci, Hakan
N1 - KAUST Repository Item: Exported on 2021-02-10
PY - 2018/5
Y1 - 2018/5
N2 - By realizing the TMz modal distribution property between the power/ground plate-pairs, the magnetic field actually has only azimuthal components while longitude component is zero. Thus, if the magnetic field wave equation is solved, only a Quasi-2D issue is considered. Furthermore, since the high-order modes are only located in the near region of the anti-pad, thus for the domain far-away from the antipad has only the TEM mode. Thereby, in this region, the magnetic field is invariable along the vertical direction, which consequently is a pure 2D domain. As a result, the conventional 3D computational domain is naturally transformed to a hybrid 2D/Q-2D domain, which will significantly reduce the computational cost.
AB - By realizing the TMz modal distribution property between the power/ground plate-pairs, the magnetic field actually has only azimuthal components while longitude component is zero. Thus, if the magnetic field wave equation is solved, only a Quasi-2D issue is considered. Furthermore, since the high-order modes are only located in the near region of the anti-pad, thus for the domain far-away from the antipad has only the TEM mode. Thereby, in this region, the magnetic field is invariable along the vertical direction, which consequently is a pure 2D domain. As a result, the conventional 3D computational domain is naturally transformed to a hybrid 2D/Q-2D domain, which will significantly reduce the computational cost.
UR - http://hdl.handle.net/10754/656133
UR - https://ieeexplore.ieee.org/document/8394073/
UR - http://www.scopus.com/inward/record.url?scp=85050117867&partnerID=8YFLogxK
U2 - 10.1109/ISEMC.2018.8394073
DO - 10.1109/ISEMC.2018.8394073
M3 - Conference contribution
AN - SCOPUS:85050117867
SN - 9781509059973
BT - 2018 IEEE International Symposium on Electromagnetic Compatibility and 2018 IEEE Asia-Pacific Symposium on Electromagnetic Compatibility (EMC/APEMC)
PB - Institute of Electrical and Electronics Engineers (IEEE)
ER -