A novel low temperature integration of hybrid CMOS devices on flexible substrates

Engineering

• Low-Temperature 100%
• Flexible Substrate 100%
• Thin-Film Transistor 100%
• Process Flow 33%
• Gate Dielectric 33%
• Pentacene 33%
• Channel Device 33%
• Integration Approach 33%
• Demonstrates 33%
• Carrier Mobility 33%

Material Science

• Thin-Film Transistor 100%
• Flexible Substrate 100%
• Electronic Circuit 66%
• Inverter 66%
• Dielectric Material 33%
• Polyethylene 33%
• Carrier Mobility 33%
• Amorphous Silicon 33%

Keyphrases

• Temperature Integration 100%
• Hybrid CMOS 100%
• CMOS Circuits 66%
• Voltage Transfer 33%
• Transfer Curves 33%
• CMOS Gate 33%
• CMOS Inverter 33%
• CMOS Integration 33%