A study of sulphur assisted corrosion in technologies with copper interconnects

Nitin R. Kamat; Manni Lal; Chong Khiam Oh; Kun Li

doi:10.1109/IPFA.2006.251026

A study of sulphur assisted corrosion in technologies with copper interconnects

Nitin R. Kamat^*, Manni Lal, Chong Khiam Oh, Kun Li

^*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

Original language	English (US)
Title of host publication	Proceedings of 13th International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA 2006
Pages	183-186
Number of pages	4
DOIs	https://doi.org/10.1109/IPFA.2006.251026
State	Published - 2006
Externally published	Yes
Event	13th International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA 2006 - Singapore, Singapore Duration: Jul 3 2006 → Jul 7 2006

Publication series

Name	Proceedings of the International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA

Other

Other	13th International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA 2006
Country/Territory	Singapore
City	Singapore
Period	07/3/06 → 07/7/06

ASJC Scopus subject areas

General Engineering

Access to Document

10.1109/IPFA.2006.251026

Cite this

Kamat, N. R., Lal, M., Oh, C. K., & Li, K. (2006). A study of sulphur assisted corrosion in technologies with copper interconnects. In Proceedings of 13th International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA 2006 (pp. 183-186). Article 4017051 (Proceedings of the International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA). https://doi.org/10.1109/IPFA.2006.251026

Kamat, Nitin R. ; Lal, Manni ; Oh, Chong Khiam et al. / A study of sulphur assisted corrosion in technologies with copper interconnects. Proceedings of 13th International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA 2006. 2006. pp. 183-186 (Proceedings of the International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA).

@inproceedings{1ced6dd2b89a4468b098faa06202e4b1,

title = "A study of sulphur assisted corrosion in technologies with copper interconnects",

author = "Kamat, {Nitin R.} and Manni Lal and Oh, {Chong Khiam} and Kun Li",

year = "2006",

doi = "10.1109/IPFA.2006.251026",

language = "English (US)",

isbn = "1424402069",

series = "Proceedings of the International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA",

pages = "183--186",

booktitle = "Proceedings of 13th International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA 2006",

note = "13th International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA 2006 ; Conference date: 03-07-2006 Through 07-07-2006",

}

Kamat, NR, Lal, M, Oh, CK & Li, K 2006, A study of sulphur assisted corrosion in technologies with copper interconnects. in Proceedings of 13th International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA 2006., 4017051, Proceedings of the International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA, pp. 183-186, 13th International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA 2006, Singapore, Singapore, 07/3/06. https://doi.org/10.1109/IPFA.2006.251026

A study of sulphur assisted corrosion in technologies with copper interconnects. / Kamat, Nitin R.; Lal, Manni; Oh, Chong Khiam et al.
Proceedings of 13th International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA 2006. 2006. p. 183-186 4017051 (Proceedings of the International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

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AU - Oh, Chong Khiam

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T3 - Proceedings of the International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA

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T2 - 13th International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA 2006

Y2 - 3 July 2006 through 7 July 2006

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Kamat NR, Lal M, Oh CK, Li K. A study of sulphur assisted corrosion in technologies with copper interconnects. In Proceedings of 13th International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA 2006. 2006. p. 183-186. 4017051. (Proceedings of the International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA). doi: 10.1109/IPFA.2006.251026

A study of sulphur assisted corrosion in technologies with copper interconnects

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Other

ASJC Scopus subject areas

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