A study of sulphur assisted corrosion in technologies with copper interconnects

Nitin R. Kamat; Manni Lal; Chong Khiam Oh; Kun Li

doi:10.1109/IPFA.2006.251026

A study of sulphur assisted corrosion in technologies with copper interconnects

Nitin R. Kamat^*, Manni Lal, Chong Khiam Oh, Kun Li

^*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

Original language	English (US)
Title of host publication	Proceedings of 13th International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA 2006
Pages	183-186
Number of pages	4
DOIs	https://doi.org/10.1109/IPFA.2006.251026
State	Published - 2006
Externally published	Yes
Event	13th International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA 2006 - Singapore, Singapore Duration: Jul 3 2006 → Jul 7 2006

Other

Other	13th International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA 2006
Country/Territory	Singapore
City	Singapore
Period	07/3/06 → 07/7/06

ASJC Scopus subject areas

Engineering(all)

Access to Document

10.1109/IPFA.2006.251026

Cite this

@inproceedings{1ced6dd2b89a4468b098faa06202e4b1,

title = "A study of sulphur assisted corrosion in technologies with copper interconnects",

author = "Kamat, {Nitin R.} and Manni Lal and Oh, {Chong Khiam} and Kun Li",

year = "2006",

doi = "10.1109/IPFA.2006.251026",

language = "English (US)",

isbn = "1424402069",

pages = "183--186",

booktitle = "Proceedings of 13th International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA 2006",

note = "13th International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA 2006 ; Conference date: 03-07-2006 Through 07-07-2006",

}

Kamat, NR, Lal, M, Oh, CK & Li, K 2006, A study of sulphur assisted corrosion in technologies with copper interconnects. in Proceedings of 13th International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA 2006., 4017051, pp. 183-186, 13th International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA 2006, Singapore, Singapore, 07/3/06. https://doi.org/10.1109/IPFA.2006.251026

A study of sulphur assisted corrosion in technologies with copper interconnects. / Kamat, Nitin R.; Lal, Manni; Oh, Chong Khiam et al.
Proceedings of 13th International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA 2006. 2006. p. 183-186 4017051.

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

TY - GEN

T1 - A study of sulphur assisted corrosion in technologies with copper interconnects

AU - Kamat, Nitin R.

AU - Lal, Manni

AU - Oh, Chong Khiam

AU - Li, Kun

PY - 2006

Y1 - 2006

UR - http://www.scopus.com/inward/record.url?scp=34250675748&partnerID=8YFLogxK

U2 - 10.1109/IPFA.2006.251026

DO - 10.1109/IPFA.2006.251026

M3 - Conference contribution

AN - SCOPUS:34250675748

SN - 1424402069

SN - 9781424402069

SP - 183

EP - 186

BT - Proceedings of 13th International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA 2006

T2 - 13th International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA 2006

Y2 - 3 July 2006 through 7 July 2006

ER -

A study of sulphur assisted corrosion in technologies with copper interconnects

Other

ASJC Scopus subject areas

Access to Document

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