Engineering
Microelectronics
100%
Thermal Exposure
100%
Material Interface
100%
Joints (Structural Components)
100%
Heat Source
100%
Mountings
100%
Joining Technology
100%
Numerical Modeling
100%
Room Temperature
100%
Thermal Conductivity
100%
Thermal Resistance
100%
Exothermic Reaction
100%
Keyphrases
Heat Sink
100%
Interface Thermal Resistance
100%
Order of Magnitude
50%
Soldering
50%
Joining Processes
50%
Chip Package
50%
Nanotechnology
25%
Room Temperature
25%
Argon
25%
Heat Generated
25%
Thermal Conductivity
25%
High Resistivity
25%
Numerical Modeling
25%
Chemical Reaction
25%
New Platform
25%
Local Heat Source
25%
Engineered Materials
25%
Thermal Exposure
25%
Nanoengineering
25%
Reactive multilayer Foils
25%
Multilayer Foils
25%
Solder Layer
25%
Reactive Joining
25%
Metallic Bonding
25%
Microelectronics Packaging
25%
Hot Filament
25%
Self-propagating Exothermic Reaction
25%
Thermal Interface Resistance
25%
Joining Technology
25%
Thermal Interface Materials
25%
Thermal Resistivity
25%
Metallic Joint
25%
Material Science
Thermal Conductivity
100%
Interface (Material)
100%
Thermal Resistivity
100%
Heat Resistance
100%