Accelerated life-time testing and resistance degradation of thin-film decoupling capacitors

Husam Al-Shareef*, Duane Dimos

*Corresponding author for this work

Research output: Contribution to conferencePaperpeer-review

14 Scopus citations

Abstract

Resistance degradation in PZT thin-film capacitors has been studied as a function of applied voltage, temperature, and film composition. It is found that the mean-time-to-failure (life-time or tf) of the capacitors shows a power law dependence on applied voltage of the form tf∝V-n (n to approximately 4-5). The capacitor life-time also (tf) exhibits a temperature dependence of the form tf∝exp(Ea/kT), with an activation energy of approximately 0.8 eV. The steady-state leakage current in these samples appears to be bulk controlled. The voltage, temperature, and polarity dependence of the leakage current collectively suggest a leakage current mechanism most similar to a Frenkel-Poole process. The Nb-doped PZT films exhibit superior life-time and leakage current to the undoped PZT films. This result can be explained based on the point-defect chemistry of the PZT system. Finally, the results indicate that the Nb-doped PZT films meet the essential requirements for decoupling capacitor applications.

Original languageEnglish (US)
Pages421-425
Number of pages5
StatePublished - 1996
Externally publishedYes
EventProceedings of the 1996 10th IEEE International Symposium on Applications of Ferroelectrics, ISAF. Part 1 (of 2) - East Brunswick, NJ, USA
Duration: Aug 18 1996Aug 21 1996

Other

OtherProceedings of the 1996 10th IEEE International Symposium on Applications of Ferroelectrics, ISAF. Part 1 (of 2)
CityEast Brunswick, NJ, USA
Period08/18/9608/21/96

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Electrical and Electronic Engineering

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