Accurate modeling of substrate coupling for substrates without grounded backplates

Q. Su, Y. Massoud, J. Kawa, C. Chiang

Research output: Chapter in Book/Report/Conference proceedingConference contribution

11 Scopus citations

Abstract

An accurate and numerically stable formulation is presented for the substrate resistive coupling using boundary element methods, for floating substrates (without grounded backplates).
Original languageEnglish (US)
Title of host publicationProceedings - IEEE International SOC Conference, SOCC 2003
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages281-282
Number of pages2
ISBN (Print)0780381823
DOIs
StatePublished - Jan 1 2003
Externally publishedYes

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