Abstract
An activable electronic component destruction device includes a heater and a heat-activated expandable material arranged on top of the heater. Heating of the heater causes the heat-activated expandable material to expand. The device further includes activation electronics coupled to the heater. The activation electronics are configured to control supply of power to the heater, which causes the heater to heat the heat-activated expandable material, which breaks a semiconductor substrate arranged on top of the heat-activated expandable material.
| Original language | English (US) |
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| Patent number | WO2018069780A1 |
| State | Published - Apr 19 2018 |