Abstract
A new molecule, bis(hexylthieno)benzobisthiazole 1, which self-assembles in the solid state to give intermolecular close contacts in all three dimensions, is presented. This structure represents a highly promising new packing mode that eliminates the significant problem of manipulating molecular alignment within an OFET device, since charges will propagate efficiently between source and drain, irrespective of the orientation obtained during deposition. Higher values for hole mobility are probably restricted by the large difference between the HOMO of 1 and the work function of the gold electrode.
Original language | English (US) |
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Pages (from-to) | 4438-4442 |
Number of pages | 5 |
Journal | Advanced Materials |
Volume | 19 |
Issue number | 24 |
DOIs | |
State | Published - Dec 17 2007 |
Externally published | Yes |
ASJC Scopus subject areas
- General Materials Science
- Mechanics of Materials
- Mechanical Engineering