TY - GEN
T1 - All inkjet printed 3D microwave capacitors and inductors with vias
AU - McKerricher, Garret
AU - González, Juan Carlos Cano
AU - Shamim, Atif
N1 - KAUST Repository Item: Exported on 2020-10-01
PY - 2013/6
Y1 - 2013/6
N2 - For the first time we present a method to create all inkjet printed multilayer RF passive components including vias. Although there has been previous work on multilayer RF components, they are not fully inkjet printed and involve complicated processing techniques such as laser cutting, conductive epoxy, or reactive ion etching This work demonstrates a truly all inkjet printed solution with a novel dissolving method for vias realization. A major issue with inkjet printing is often surface roughness, however by processing these materials at low temperature surface roughness
AB - For the first time we present a method to create all inkjet printed multilayer RF passive components including vias. Although there has been previous work on multilayer RF components, they are not fully inkjet printed and involve complicated processing techniques such as laser cutting, conductive epoxy, or reactive ion etching This work demonstrates a truly all inkjet printed solution with a novel dissolving method for vias realization. A major issue with inkjet printing is often surface roughness, however by processing these materials at low temperature surface roughness
UR - http://hdl.handle.net/10754/564729
UR - http://ieeexplore.ieee.org/document/6697784/
UR - http://www.scopus.com/inward/record.url?scp=84893313651&partnerID=8YFLogxK
U2 - 10.1109/MWSYM.2013.6697784
DO - 10.1109/MWSYM.2013.6697784
M3 - Conference contribution
SN - 9781467361767
BT - 2013 IEEE MTT-S International Microwave Symposium Digest (MTT)
PB - Institute of Electrical and Electronics Engineers (IEEE)
ER -