TY - GEN
T1 - An Experimental Investigation of the Dynamic Behavior of an In-Plane MEMS Shallow Arch Under Electrostatic Excitation
AU - Ramini, Abdallah
AU - Hafiz, Md Abdullah Al
AU - Bellaredj, Mohammed Lamine Faycal
AU - Al Hennawi, Qais M.
AU - Younis, Mohammad I.
N1 - KAUST Repository Item: Exported on 2020-10-01
PY - 2016/1/20
Y1 - 2016/1/20
N2 - We present experimental investigation of the nonlinear dynamics of a clamped-clamped in-plane MEMS shallow arch when excited by an electrostatic force. We explore the dynamic behaviors of the in-plane motion of the shallow arches via frequency sweeps in the neighborhood of the first resonance frequency. The shallow arch response is video microscopy recorded and analyzed by means of digital imaging. The experimental data show local softening behavior for small DC and AC loads. For high voltages, the experimental investigation reveals interesting dynamics, where the arch exhibits a dynamic snap-Through behavior. These attractive experimental results verify the previously reported complex behavior of in-plane MEMS arches and show promising results to implement these structures for variety of sensing and actuation applications. © Copyright 2015 by ASME.
AB - We present experimental investigation of the nonlinear dynamics of a clamped-clamped in-plane MEMS shallow arch when excited by an electrostatic force. We explore the dynamic behaviors of the in-plane motion of the shallow arches via frequency sweeps in the neighborhood of the first resonance frequency. The shallow arch response is video microscopy recorded and analyzed by means of digital imaging. The experimental data show local softening behavior for small DC and AC loads. For high voltages, the experimental investigation reveals interesting dynamics, where the arch exhibits a dynamic snap-Through behavior. These attractive experimental results verify the previously reported complex behavior of in-plane MEMS arches and show promising results to implement these structures for variety of sensing and actuation applications. © Copyright 2015 by ASME.
UR - http://hdl.handle.net/10754/621239
UR - https://asmedigitalcollection.asme.org/IDETC-CIE/proceedings/IDETC-CIE2015/57113/Boston,%20Massachusetts,%20USA/254890
UR - http://www.scopus.com/inward/record.url?scp=84978926998&partnerID=8YFLogxK
U2 - 10.1115/DETC2015-47070
DO - 10.1115/DETC2015-47070
M3 - Conference contribution
SN - 9780791857113
BT - Volume 4: 20th Design for Manufacturing and the Life Cycle Conference; 9th International Conference on Micro- and Nanosystems
PB - ASME International
ER -