TY - GEN
T1 - Axially modulated clamped-guided arch resonator for memory and logic applications
AU - Al Hafiz, Md Abdullah
AU - Tella, Sherif
AU - Alcheikh, Nouha
AU - Fariborzi, Hossein
AU - Younis, Mohammad I.
N1 - Publisher Copyright:
© Copyright 2017 ASME.
PY - 2017
Y1 - 2017
N2 - We experimentally demonstrate memory and logic devices based on an axially modulated clamped-guided arch resonator. The device are electrostatically actuated and capacitively sensed, while the resonance frequency modulation is achieved through an axial electrostatic force from the guided side of the clamped-guided arch microbeam. We present two case studies: first, a dynamic memory based on the nonlinear frequency response of the resonator, and second, a reprogrammable two-input logic gate based on the linear frequency modulation of the resonator. These devices show energy cost per memory/logic operation in pJ, are fully compatible with CMOS fabrication processes, have the potential for on-chip system integration, and operate at room temperature.
AB - We experimentally demonstrate memory and logic devices based on an axially modulated clamped-guided arch resonator. The device are electrostatically actuated and capacitively sensed, while the resonance frequency modulation is achieved through an axial electrostatic force from the guided side of the clamped-guided arch microbeam. We present two case studies: first, a dynamic memory based on the nonlinear frequency response of the resonator, and second, a reprogrammable two-input logic gate based on the linear frequency modulation of the resonator. These devices show energy cost per memory/logic operation in pJ, are fully compatible with CMOS fabrication processes, have the potential for on-chip system integration, and operate at room temperature.
KW - Axial stress modulation
KW - Clamped-guided arch resonator
KW - Electromechanical computation
KW - Mechanical memory
UR - http://www.scopus.com/inward/record.url?scp=85034748448&partnerID=8YFLogxK
U2 - 10.1115/DETC2017-68284
DO - 10.1115/DETC2017-68284
M3 - Conference contribution
AN - SCOPUS:85034748448
T3 - Proceedings of the ASME Design Engineering Technical Conference
BT - 22nd Design for Manufacturing and the Life Cycle Conference; 11th International Conference on Micro- and Nanosystems
PB - American Society of Mechanical Engineers (ASME)
T2 - ASME 2017 International Design Engineering Technical Conferences and Computers and Information in Engineering Conference, IDETC/CIE 2017
Y2 - 6 August 2017 through 9 August 2017
ER -