BEOL test chip for rapid technology and process integration debugging

Y. C. Ee, J. B. Tan, B. C. Zhang, F. Zhang, Y. L. Yao, P. K. Tan, C. S. Chee, C. K. Koo, Xianbin Wang, D. K. Sohn, T. Fu, L. C. Hsia, A. Inani, N. Akiya, L. Yuan, A. Agarwal

    Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review


    Major technological breakthroughs have historically depended on new materials, new designs and novel processing methods. In our 65nm process development, we have employed PDF Solutions' BEOL Characterization Vehicle® (CV®)[1] test chip infrastructure to debug and improve the process performance. Using an integrated methodology based on a well designed test chip which contains a significant number of experiments aimed at exploring potential systematic and random failure modes, along with a unique fast testing scheme and fast analysis software has allowed us to accelerate the evaluation of multiple aspects of process development using a significantly reduced wafer count. An electrical measurement based short flow methodology has also allowed shorter learning cycles thereby increasing the rate of process development. In this paper, our methodology, along with examples, to study three major aspects, namely, electrical and inline defect correlation for manufacturing improvement, process optimization and design for manufacturing (DFM) using this test chip are discussed.

    Original languageEnglish (US)
    Title of host publicationAdvanced Metallization Conference 2007, AMC 2007
    Number of pages5
    StatePublished - Nov 10 2008
    Event24th Session of the Advanced Metallization Conference 2007, AMC 2007 - Tokyo, Japan
    Duration: Oct 22 2007Oct 24 2007

    Publication series

    NameAdvanced Metallization Conference (AMC)
    ISSN (Print)1540-1766


    Other24th Session of the Advanced Metallization Conference 2007, AMC 2007

    ASJC Scopus subject areas

    • Materials Science(all)
    • Industrial and Manufacturing Engineering


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