Bonding processes

M. Powers, S. Sen, T. Nguyentat, O. M. Knio, T. P. Weihs

Research output: Chapter in Book/Report/Conference proceedingChapterpeer-review


This chapter outlines four primary technological processes associated with the interfacial bonding of both similar and dissimilar advanced engineering materials; glass-to-metal sealing, ceramic-to-metal joining, diffusion bonding, and reactive joining. The first section will cover the principles and theoretical foundations for interfacial bonding including relative surface energy, wetting behavior and the Young Equation, sessile drop experiments, and the Ellingham diagram of the oxides. The following sections will provide overviews of the joining procedures and the basis for their application. In each case, references to the original work will be cited for further study and in-depth investigation. Case studies will be provided to define and highlight areas of application, as well as demonstrate the utility of a particular bonding process.

Original languageEnglish (US)
Title of host publicationMaterials Processing Handbook
PublisherCRC Press
Number of pages31
ISBN (Electronic)9781420004823
ISBN (Print)0849332168, 9780849332166
StatePublished - Jan 1 2007

ASJC Scopus subject areas

  • General Engineering
  • General Materials Science


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