Characterizing ABS–copper chemistry-dependent adhesion: From the atomic to macro level

The electroplating of copper layers on acrylonitrile–butadiene–styrene (ABS) polymer surfaces is a common need in industrial applications. The development of new eco-friendly techniques to promote ABS–copper adhesion is crucial due to the harsh and expensive chemicals used in the existing processes. The initial path involves establishing a better understanding on chemistry-dependent ABS–copper adhesion mechanisms. By formulating the material with more functional groups, the adhesion between ABS and the coated copper layer was characterized through a multiscale approach. At the atomic scale, we performed ab initio density functional theory simulations to obtain the variations in the adsorption energy. At the nano and micro scales, we adopted atomic force microscopy to measure the adhesion forces on the bulk polymer surfaces. At the macro scale, we compared these adhesion results with both 90-degree peeling tests and finite element model analyses. This study presents the first comprehensive approach for bridging information gaps across the scales (from nano to macro) with computational and experimental data, facilitating the design of formulated ABS additives.