TY - JOUR
T1 - Comparison of on-chip MIS capacitors based on stacked HfO2/Al2O3 nanolaminates
AU - Kartci, Aslihan
AU - Vancik, Silvester
AU - Prasek, Jan
AU - Hrdy, Radim
AU - Schneider, Michael
AU - Schmid, Ulrich
AU - Hubalek, Jaromir
N1 - KAUST Repository Item: Exported on 2022-12-01
Acknowledgements: The work was supported by Grant Agency of the Czech Republic under the contracts GA17-27340S, the Horizon 2020 Research and Innovation Programme under the SINNCE project (GA 810626). For research, infrastructure of the SIX Centre was used. We also acknowledge the support of Central European Institute of Technology (CEITEC) Nano Research Infrastructure (ID LM2015041, MEYS CR,2016–2019), CEITEC Brno University of Technology, where the structures were fabricated.
PY - 2022/10/25
Y1 - 2022/10/25
N2 - High-κ dielectric materials are commonly used in microelectronic components due to the technological necessity of increasing the capacitance density of dielectric layers. The thickness of the layer is a crucial parameter of this technology because it has a significant influence on dielectric properties, capacitance density, leakage current density–voltage (J–V), breakdown voltage, and capacitance density–voltage (C–V). Among metal oxide compounds, HfO2 and Al2O3 have been widely studied due to their good thermodynamic stability in contact with silicon. Thus, in this study, devices are fabricated by atomic layer deposition (ALD) processes on Si wafer. Properties of HfO2/Al2O3-based stack dielectric as on-chip MIS capacitors are investigated. The capacitance density, C–V, J–V, impedance characteristics, equivalent dielectric constant, breakdown voltage, and leakage current are studied on stacks (HfO2/Al2O3) with a thickness ratio of 1:1. The experimental results indicate very good leakage current and good breakdown voltage. Oxygen vacancies play a significant role in increasing the conductance and contrarily decreasing the equivalent dielectric constant of the stack.
AB - High-κ dielectric materials are commonly used in microelectronic components due to the technological necessity of increasing the capacitance density of dielectric layers. The thickness of the layer is a crucial parameter of this technology because it has a significant influence on dielectric properties, capacitance density, leakage current density–voltage (J–V), breakdown voltage, and capacitance density–voltage (C–V). Among metal oxide compounds, HfO2 and Al2O3 have been widely studied due to their good thermodynamic stability in contact with silicon. Thus, in this study, devices are fabricated by atomic layer deposition (ALD) processes on Si wafer. Properties of HfO2/Al2O3-based stack dielectric as on-chip MIS capacitors are investigated. The capacitance density, C–V, J–V, impedance characteristics, equivalent dielectric constant, breakdown voltage, and leakage current are studied on stacks (HfO2/Al2O3) with a thickness ratio of 1:1. The experimental results indicate very good leakage current and good breakdown voltage. Oxygen vacancies play a significant role in increasing the conductance and contrarily decreasing the equivalent dielectric constant of the stack.
UR - http://hdl.handle.net/10754/679898
UR - https://linkinghub.elsevier.com/retrieve/pii/S2352492822015057
UR - http://www.scopus.com/inward/record.url?scp=85140728372&partnerID=8YFLogxK
U2 - 10.1016/j.mtcomm.2022.104664
DO - 10.1016/j.mtcomm.2022.104664
M3 - Article
SN - 2352-4928
VL - 33
SP - 104664
JO - Materials Today Communications
JF - Materials Today Communications
ER -