Constitutive and damage model for solders

V. Stolkarts; B. Moran; L. M. Keer

doi:10.1109/ECTC.1998.678721

Constitutive and damage model for solders

V. Stolkarts, B. Moran, L. M. Keer

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

25 Scopus citations

Abstract

A unified creep-plasticity model with damage is introduced and employed to simulate the isothermal cyclic behavior of Sn-Ag solder. The proposed damage evolution law is based on a nonlinear accumulation of damage and an interaction between applied load and creep. The stress drop amplitude and hysteresis loops are modeled over a wide range of loading conditions.

Original language	English (US)
Title of host publication	1998 Proceedings - 48th Electronic Components and Technology Conference, ECTC 1998
Publisher	Institute of Electrical and Electronics Engineers Inc.
Pages	379-385
Number of pages	7
ISBN (Print)	0780345266
DOIs	https://doi.org/10.1109/ECTC.1998.678721
State	Published - 1998
Externally published	Yes
Event	48th Electronic Components and Technology Conference, ECTC 1998 - Seattle, United States Duration: May 25 1998 → May 28 1998

Publication series

Name	Proceedings - Electronic Components and Technology Conference
Volume	Part F133492
ISSN (Print)	0569-5503

Other

Other	48th Electronic Components and Technology Conference, ECTC 1998
Country/Territory	United States
City	Seattle
Period	05/25/98 → 05/28/98

ASJC Scopus subject areas

Electronic, Optical and Magnetic Materials
Electrical and Electronic Engineering

Access to Document

10.1109/ECTC.1998.678721

Cite this

Stolkarts, V., Moran, B., & Keer, L. M. (1998). Constitutive and damage model for solders. In 1998 Proceedings - 48th Electronic Components and Technology Conference, ECTC 1998 (pp. 379-385). Article 678721 (Proceedings - Electronic Components and Technology Conference; Vol. Part F133492). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/ECTC.1998.678721

@inproceedings{be1a5dbd399744eb95b258161ed7e2df,

title = "Constitutive and damage model for solders",

abstract = "A unified creep-plasticity model with damage is introduced and employed to simulate the isothermal cyclic behavior of Sn-Ag solder. The proposed damage evolution law is based on a nonlinear accumulation of damage and an interaction between applied load and creep. The stress drop amplitude and hysteresis loops are modeled over a wide range of loading conditions.",

author = "V. Stolkarts and B. Moran and Keer, {L. M.}",

note = "Publisher Copyright: {\textcopyright} 1998 IEEE.; 48th Electronic Components and Technology Conference, ECTC 1998 ; Conference date: 25-05-1998 Through 28-05-1998",

year = "1998",

doi = "10.1109/ECTC.1998.678721",

language = "English (US)",

isbn = "0780345266",

series = "Proceedings - Electronic Components and Technology Conference",

publisher = "Institute of Electrical and Electronics Engineers Inc.",

pages = "379--385",

booktitle = "1998 Proceedings - 48th Electronic Components and Technology Conference, ECTC 1998",

address = "United States",

}

Stolkarts, V, Moran, B & Keer, LM 1998, Constitutive and damage model for solders. in 1998 Proceedings - 48th Electronic Components and Technology Conference, ECTC 1998., 678721, Proceedings - Electronic Components and Technology Conference, vol. Part F133492, Institute of Electrical and Electronics Engineers Inc., pp. 379-385, 48th Electronic Components and Technology Conference, ECTC 1998, Seattle, United States, 05/25/98. https://doi.org/10.1109/ECTC.1998.678721

Constitutive and damage model for solders. / Stolkarts, V.; Moran, B.; Keer, L. M.
1998 Proceedings - 48th Electronic Components and Technology Conference, ECTC 1998. Institute of Electrical and Electronics Engineers Inc., 1998. p. 379-385 678721 (Proceedings - Electronic Components and Technology Conference; Vol. Part F133492).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

TY - GEN

T1 - Constitutive and damage model for solders

AU - Stolkarts, V.

AU - Moran, B.

AU - Keer, L. M.

PY - 1998

Y1 - 1998

N2 - A unified creep-plasticity model with damage is introduced and employed to simulate the isothermal cyclic behavior of Sn-Ag solder. The proposed damage evolution law is based on a nonlinear accumulation of damage and an interaction between applied load and creep. The stress drop amplitude and hysteresis loops are modeled over a wide range of loading conditions.

AB - A unified creep-plasticity model with damage is introduced and employed to simulate the isothermal cyclic behavior of Sn-Ag solder. The proposed damage evolution law is based on a nonlinear accumulation of damage and an interaction between applied load and creep. The stress drop amplitude and hysteresis loops are modeled over a wide range of loading conditions.

UR - http://www.scopus.com/inward/record.url?scp=0031636715&partnerID=8YFLogxK

U2 - 10.1109/ECTC.1998.678721

DO - 10.1109/ECTC.1998.678721

M3 - Conference contribution

AN - SCOPUS:0031636715

SN - 0780345266

T3 - Proceedings - Electronic Components and Technology Conference

SP - 379

EP - 385

BT - 1998 Proceedings - 48th Electronic Components and Technology Conference, ECTC 1998

PB - Institute of Electrical and Electronics Engineers Inc.

T2 - 48th Electronic Components and Technology Conference, ECTC 1998

Y2 - 25 May 1998 through 28 May 1998

ER -

Constitutive and damage model for solders

Abstract

Publication series

Other

ASJC Scopus subject areas

Access to Document

Other files and links

Fingerprint

Cite this