Corporate array of micromachined dipoles on silicon wafer for 60 GHz communication systems

M. O. Sallam; E. A. Soliman

doi:10.1109/IWAT.2013.6518341

Corporate array of micromachined dipoles on silicon wafer for 60 GHz communication systems

M. O. Sallam, E. A. Soliman

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

1 Scopus citations

Abstract

In this paper, an antenna array operating at 60 GHz and realized on 0.675 mm thick silicon substrate is presented. The array is constructed using four micromachined half-wavelength dipoles fed by a corporate feeding network. Isolation between the antenna array and its feeding network is achieved via a ground plane. This arrangement leads to maximizing the broadside radiation with relatively high front-to-back ratio. Simulations have been carried out using both HFSS and CST, which showed very good agreement. Results reveal that the proposed antenna array has good radiation characteristics, where the directivity, gain, and radiation efficiency are around 10.5 dBi, 9.5 dBi, and 79%, respectively. © 2013 IEEE.

Original language	English (US)
Title of host publication	2013 International Workshop on Antenna Technology (iWAT)
Publisher	Institute of Electrical and Electronics Engineers (IEEE)
Pages	240-243
Number of pages	4
ISBN (Print)	9781467328319
DOIs	https://doi.org/10.1109/IWAT.2013.6518341
State	Published - Mar 2013
Externally published	Yes

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10.1109/IWAT.2013.6518341

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@inproceedings{434735d1a4444e11996a1573a7447f0f,

title = "Corporate array of micromachined dipoles on silicon wafer for 60 GHz communication systems",

abstract = "In this paper, an antenna array operating at 60 GHz and realized on 0.675 mm thick silicon substrate is presented. The array is constructed using four micromachined half-wavelength dipoles fed by a corporate feeding network. Isolation between the antenna array and its feeding network is achieved via a ground plane. This arrangement leads to maximizing the broadside radiation with relatively high front-to-back ratio. Simulations have been carried out using both HFSS and CST, which showed very good agreement. Results reveal that the proposed antenna array has good radiation characteristics, where the directivity, gain, and radiation efficiency are around 10.5 dBi, 9.5 dBi, and 79%, respectively. {\textcopyright} 2013 IEEE.",

author = "Sallam, {M. O.} and Soliman, {E. A.}",

note = "KAUST Repository Item: Exported on 2020-10-01 Acknowledged KAUST grant number(s): UK-C0015 OUK Acknowledgements: This publication is based on work supported by award number: UK-C0015 OUK made by King Abdullah University of Science and Technology (KAUST). This publication acknowledges KAUST support, but has no KAUST affiliated authors.",

year = "2013",

month = mar,

doi = "10.1109/IWAT.2013.6518341",

language = "English (US)",

isbn = "9781467328319",

pages = "240--243",

booktitle = "2013 International Workshop on Antenna Technology (iWAT)",

publisher = "Institute of Electrical and Electronics Engineers (IEEE)",

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TY - GEN

T1 - Corporate array of micromachined dipoles on silicon wafer for 60 GHz communication systems

AU - Sallam, M. O.

AU - Soliman, E. A.

N1 - KAUST Repository Item: Exported on 2020-10-01 Acknowledged KAUST grant number(s): UK-C0015 OUK Acknowledgements: This publication is based on work supported by award number: UK-C0015 OUK made by King Abdullah University of Science and Technology (KAUST). This publication acknowledges KAUST support, but has no KAUST affiliated authors.

PY - 2013/3

Y1 - 2013/3

N2 - In this paper, an antenna array operating at 60 GHz and realized on 0.675 mm thick silicon substrate is presented. The array is constructed using four micromachined half-wavelength dipoles fed by a corporate feeding network. Isolation between the antenna array and its feeding network is achieved via a ground plane. This arrangement leads to maximizing the broadside radiation with relatively high front-to-back ratio. Simulations have been carried out using both HFSS and CST, which showed very good agreement. Results reveal that the proposed antenna array has good radiation characteristics, where the directivity, gain, and radiation efficiency are around 10.5 dBi, 9.5 dBi, and 79%, respectively. © 2013 IEEE.

AB - In this paper, an antenna array operating at 60 GHz and realized on 0.675 mm thick silicon substrate is presented. The array is constructed using four micromachined half-wavelength dipoles fed by a corporate feeding network. Isolation between the antenna array and its feeding network is achieved via a ground plane. This arrangement leads to maximizing the broadside radiation with relatively high front-to-back ratio. Simulations have been carried out using both HFSS and CST, which showed very good agreement. Results reveal that the proposed antenna array has good radiation characteristics, where the directivity, gain, and radiation efficiency are around 10.5 dBi, 9.5 dBi, and 79%, respectively. © 2013 IEEE.

UR - http://hdl.handle.net/10754/597884

UR - http://ieeexplore.ieee.org/document/6518341/

UR - http://www.scopus.com/inward/record.url?scp=84879036602&partnerID=8YFLogxK

U2 - 10.1109/IWAT.2013.6518341

DO - 10.1109/IWAT.2013.6518341

M3 - Conference contribution

SN - 9781467328319

SP - 240

EP - 243

BT - 2013 International Workshop on Antenna Technology (iWAT)

PB - Institute of Electrical and Electronics Engineers (IEEE)

ER -

Corporate array of micromachined dipoles on silicon wafer for 60 GHz communication systems

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