TY - JOUR
T1 - Decal Electronics: Printable Packaged with 3D Printing High-Performance Flexible CMOS Electronic Systems
AU - Sevilla, Galo T.
AU - Diaz, Marlon
AU - Nassar, Joanna M.
AU - Hanna, Amir
AU - Kutbee, Arwa T.
AU - Carreno, Armando Arpys Arevalo
AU - Hussain, Muhammad Mustafa
N1 - KAUST Repository Item: Exported on 2020-10-01
Acknowledged KAUST grant number(s): BAS/1/1619-01-01
Acknowledgements: This publication was based upon work supported by the King Abdullah University of Science and Technology (KAUST) Office of Sponsored Research (OSR) under Award No. BAS/1/1619-01-01. The authors are deeply grateful to Prof. Sigurdur T. Thoroddsen for the 3D printing resources made available to the authors in his High Speed Imaging Lab of KAUST. The authors also thank Seneca J. Velling, Visiting Undergradaute Research Intern from the University of Waterloo for proof reading the manuscript.
PY - 2016/10/13
Y1 - 2016/10/13
N2 - High-performance complementary metal oxide semiconductor electronics are flexed, packaged using 3D printing as decal electronics, and then printed in roll-to-roll fashion for highly manufacturable printed flexible high-performance electronic systems.
AB - High-performance complementary metal oxide semiconductor electronics are flexed, packaged using 3D printing as decal electronics, and then printed in roll-to-roll fashion for highly manufacturable printed flexible high-performance electronic systems.
UR - http://hdl.handle.net/10754/623817
UR - http://onlinelibrary.wiley.com/doi/10.1002/admt.201600175/abstract
UR - http://www.scopus.com/inward/record.url?scp=85020963353&partnerID=8YFLogxK
U2 - 10.1002/admt.201600175
DO - 10.1002/admt.201600175
M3 - Article
SN - 2365-709X
VL - 2
SP - 1600175
JO - Advanced Materials Technologies
JF - Advanced Materials Technologies
IS - 1
ER -