TY - GEN
T1 - Demonstration of integrated micro-electro-mechanical switch circuits for VLSI applications
AU - Chen, Fred
AU - Spencer, Matthew
AU - Nathanael, Rhesa
AU - Wang, Chengcheng
AU - Fariborzi, Hossein
AU - Gupta, Abhinav
AU - Kam, Hei
AU - Pott, Vincent
AU - Jeon, Jaeseok
AU - King Liu, Tsu Jae
AU - Markovic, Dejan
AU - Stojanovic, Vladimir
AU - Alon, Elad
PY - 2010
Y1 - 2010
N2 - Due to transistor leakage, CMOS circuits have a well-defined lower limit on their achievable energy efficiency [1]. Once this limit is reached, power-constrained applications will face a cap on their maximum throughput independent of their level of parallelism. Avoiding this roadblock requires an alternate switching device with steeper sub-threshold slope-i.e., lower V DD/Ion for the same Ion/Ioff [2]. One promising class of such devices with nearly ideal Ion/I off characteristics are electro-statically actuated micro-electro-mechanical (MEM) switches [6]. Although mechanical movement makes MEM circuit delay significantly larger than that of CMOS, we have recently shown that with optimized circuit topologies MEM switches may potentially enable ∼10x lower energy over CMOS at up to ∼100MHz frequencies [3].
AB - Due to transistor leakage, CMOS circuits have a well-defined lower limit on their achievable energy efficiency [1]. Once this limit is reached, power-constrained applications will face a cap on their maximum throughput independent of their level of parallelism. Avoiding this roadblock requires an alternate switching device with steeper sub-threshold slope-i.e., lower V DD/Ion for the same Ion/Ioff [2]. One promising class of such devices with nearly ideal Ion/I off characteristics are electro-statically actuated micro-electro-mechanical (MEM) switches [6]. Although mechanical movement makes MEM circuit delay significantly larger than that of CMOS, we have recently shown that with optimized circuit topologies MEM switches may potentially enable ∼10x lower energy over CMOS at up to ∼100MHz frequencies [3].
UR - http://www.scopus.com/inward/record.url?scp=77951880158&partnerID=8YFLogxK
U2 - 10.1109/ISSCC.2010.5434010
DO - 10.1109/ISSCC.2010.5434010
M3 - Conference contribution
AN - SCOPUS:77951880158
SN - 9781424460342
T3 - Digest of Technical Papers - IEEE International Solid-State Circuits Conference
SP - 150
EP - 151
BT - 2010 IEEE International Solid-State Circuits Conference, ISSCC 2010 - Digest of Technical Papers
T2 - 2010 IEEE International Solid-State Circuits Conference, ISSCC 2010
Y2 - 7 February 2010 through 11 February 2010
ER -