Abstract
The feasibility of a miniaturized ACS was demonstrated by using advanced microfabrication techniques. In particular, it was shown that silicon dry etching conditions can be adjusted in order to get surfaces with a roughness of 100 nm or less.
Original language | English (US) |
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Pages (from-to) | 2793-2797 |
Number of pages | 5 |
Journal | Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures |
Volume | 20 |
Issue number | 6 |
DOIs | |
State | Published - Nov 2002 |
Externally published | Yes |
ASJC Scopus subject areas
- Condensed Matter Physics
- Electrical and Electronic Engineering