Abstract
In this work, the effect of ALD (atomic layer deposition) precursor HfCl4 pulse time has been investigated systematically to characterize the electrical performance of HfO2 devices. Improvement in bulk trapping and interface characteristics along with slight mobility improvement has been achieved as compared to devices with HfO2 deposited with a standard pulse time of 150ms. Moreover, these devices did not show any apparent change in EOT or leakage current characteristics. Pulse time of 450ms has been considered to be the optimized process condition. Drastic increase in pulse time (1500ms) negated the benefit.
Original language | English (US) |
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Pages | 161-168 |
Number of pages | 8 |
State | Published - 2005 |
Externally published | Yes |
Event | 207th ECS Meeting - Quebec, Canada Duration: May 16 2005 → May 20 2005 |
Other
Other | 207th ECS Meeting |
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Country/Territory | Canada |
City | Quebec |
Period | 05/16/05 → 05/20/05 |
ASJC Scopus subject areas
- General Engineering