TY - GEN
T1 - Effects of wafer-level packaging on millimetre-wave antennas
AU - Abutarboush, Hattan
AU - Tawfik, Hani H.
AU - Soliman, Ezzeldin A.
AU - Sallam, Mai O.
AU - Shamim, Atif
AU - Sedky, Sherif M.
N1 - KAUST Repository Item: Exported on 2020-10-01
PY - 2011/11
Y1 - 2011/11
N2 - A cost-effective antenna package suitable for mass production mm-wave applications is investigated. Different packaging material that can be possibly used in mm-wave antennas are presented and compared. Moreover, this study investigates different methods of packaging millimetre-wave (60 GHz) MEMS antennas. The paper first introduces the custom needs for optimum operation of the MEMS antenna and then examines the current available enabling technologies for packaging. The sensitivity of the antenna's reflection coefficient, gain and radiation efficiency to the packaging environment is investigated through EM simulations. © 2011 IEEE.
AB - A cost-effective antenna package suitable for mass production mm-wave applications is investigated. Different packaging material that can be possibly used in mm-wave antennas are presented and compared. Moreover, this study investigates different methods of packaging millimetre-wave (60 GHz) MEMS antennas. The paper first introduces the custom needs for optimum operation of the MEMS antenna and then examines the current available enabling technologies for packaging. The sensitivity of the antenna's reflection coefficient, gain and radiation efficiency to the packaging environment is investigated through EM simulations. © 2011 IEEE.
UR - http://hdl.handle.net/10754/564448
UR - http://ieeexplore.ieee.org/document/6113964/
UR - http://www.scopus.com/inward/record.url?scp=84856193872&partnerID=8YFLogxK
U2 - 10.1109/LAPC.2011.6113964
DO - 10.1109/LAPC.2011.6113964
M3 - Conference contribution
SN - 9781457710155
BT - 2011 Loughborough Antennas & Propagation Conference
PB - Institute of Electrical and Electronics Engineers (IEEE)
ER -