Electrical property enhancement and lattice thermal conductivity reduction of n-type Mg3Sb1.5Bi0.5-based Zintl compound by In&Se co-doping

Tong Liu, Jiansong Liao, Hang Liu, Runyu Wang, Guocai Yuan, Jing Jiang, Yi Niu, Xiaobo Lei, Lihong Huang*, Chao Wang*, Qinyong Zhang*

*Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

4 Scopus citations

Abstract

Mg3Sb1.5Bi0.5-based Zintl compounds have attracted extensive attention as potential thermoelectric materials due to their earth-abundant elements. However, pure and intrinsic Mg3Sb1.5Bi0.5 manifests a poor thermoelectric performance because of its low electrical conductivity of about 3 × 102 S/m at room temperature. In this work, In and Se co-doping was carried out to optimize the thermoelectric performance of n-type Mg3Sb1.5Bi0.5-based material. The experimental results revealed that the carrier concentration and mobility of Mg3Sb1.5Bi0.5 significantly increased after In and Se co-doping, leading to an improvement of power factor. Simultaneously, lattice thermal conductivity was significantly reduced due to the large mass difference between In and Mg. A maximum zT of 1.64 at 723 K was obtained for the Mg3.17In0.03Sb1.5Bi0.49Se0.01 sample. And an average zT value of about 1.1 between 300 and 723 K was achieved, which insures its possible application at medium temperature range as a non-toxic and low-cost TE material.

Original languageEnglish (US)
Pages (from-to)431-437
Number of pages7
JournalJournal of Materiomics
Volume9
Issue number3
DOIs
StatePublished - May 2023

Keywords

  • In&Se co-doping
  • n-type MgSbBi
  • Thermoelectric property
  • Zintl compound

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Surfaces, Coatings and Films
  • Metals and Alloys

Fingerprint

Dive into the research topics of 'Electrical property enhancement and lattice thermal conductivity reduction of n-type Mg3Sb1.5Bi0.5-based Zintl compound by In&Se co-doping'. Together they form a unique fingerprint.

Cite this