TY - PAT
T1 - Embedding complex objects with 3d printing
AU - HUSSAIN, Muhammad, Mustafa
AU - DIAZ CORDERO, Marlon, Steven
N1 - KAUST Repository Item: Exported on 2018-05-13
PY - 2017/10/12
Y1 - 2017/10/12
N2 - A CMOS technology-compatible fabrication process for flexible CMOS electronics embedded during additive manufacturing (i.e. 3D printing). A method for such a process may include printing a first portion of a 3D structure; pausing the step of printing the 3D structure to embed the flexible silicon substrate; placing the flexible silicon substrate in a cavity of the first portion of the 3D structure to embed the flexible silicon substrate in the 3D structure; and resuming the step of printing the 3D structure to form the second portion of the 3D structure.
AB - A CMOS technology-compatible fabrication process for flexible CMOS electronics embedded during additive manufacturing (i.e. 3D printing). A method for such a process may include printing a first portion of a 3D structure; pausing the step of printing the 3D structure to embed the flexible silicon substrate; placing the flexible silicon substrate in a cavity of the first portion of the 3D structure to embed the flexible silicon substrate in the 3D structure; and resuming the step of printing the 3D structure to form the second portion of the 3D structure.
UR - http://hdl.handle.net/10754/626339
UR - http://www.google.com/patents/WO2017175159A1
UR - http://worldwide.espacenet.com/publicationDetails/biblio?CC=WO&NR=2017175159A1&KC=A1&FT=D
M3 - Patent
M1 - WO 2017175159 A1
ER -