Enhanced adhesion between liquid metal ink and the wetted printer paper for direct writing electronic circuits

Lei Wang, Manxiang Wang, Jinrong Lu, Ryanda Enggar Anugrah Ardhi, Jing Liu*, Guicheng Liu, Joong Kee Lee

*Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

16 Scopus citations

Abstract

Liquid metal (In75.4 Ga24.5, LM) with its high electrical conductivity and flexibility at room temperature, has been gradually introduced into printed electronics. However, the low adhesion effect of LM on the common printer paper may restrict its potential value in reducing cost and expanding use. In this study, the surface property of the printer paper has been modified by a wetting method with a coating of micro-size droplets on the paper surface to realize a smooth writing process using the liquid metal ink. The current strategy is expected to enable future flexible electronic circuits on the hard writing substrates.

Original languageEnglish (US)
Pages (from-to)202-207
Number of pages6
JournalJournal of the Taiwan Institute of Chemical Engineers
Volume95
DOIs
StatePublished - Feb 2019

Keywords

  • Direct writing
  • Liquid metal
  • Printed electronics
  • Printer paper
  • Wetting processing

ASJC Scopus subject areas

  • General Chemistry
  • General Chemical Engineering

Fingerprint

Dive into the research topics of 'Enhanced adhesion between liquid metal ink and the wetted printer paper for direct writing electronic circuits'. Together they form a unique fingerprint.

Cite this