Erosion resistance of polycrystalline diamond films to atomic oxygen

Jingqi Li*, Qing Zhang, S. F. Yoon, J. Ahn, Qiang Zhou, Sigen Wang, Dajiang Yang, Qiang Wang

*Corresponding author for this work

    Research output: Contribution to journalArticlepeer-review

    11 Scopus citations


    Polycrystalline diamond films deposited using hot filament chemical vapor deposition (CVD) technique have been investigated in atomic oxygen simulated as low earth orbit environment to examine their erosion resistance properties. After exposure to the atomic oxygen beam with a flux of 2.6×1016 atoms/cm2 s, the diamond films only show a small mass loss. The reaction efficiency is estimated to be between 6.35×10-26 and 8.28×10-26 cm3/atom. Oxidation mechanism is investigated through the reaction temperature influence on the reaction rate. We suggest that atomic oxygen reacts with diamond surface and forms ether (C-O-C) and carbonyl (>C=O) configurations besides eroding the surface.

    Original languageEnglish (US)
    Pages (from-to)1847-1850
    Number of pages4
    Issue number9
    StatePublished - Jun 27 2003


    • A. Diamond
    • B. Oxidation
    • C. Surface oxygen complex
    • D. Reactivity

    ASJC Scopus subject areas

    • Chemistry(all)


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