Experimental study on thermal management of surface mount device-LED chips towards applicability in a headlamp of modern cars

Ich Long Ngo, Seunghwan Bang, Byeong Jun Lee

Research output: Contribution to journalArticlepeer-review

1 Scopus citations

Abstract

This paper describes an experimental study of the thermal performance of SMD-LED chips (surface mount device – light-emitting diodes) in modern car headlamps. For this purpose, a new test model is proposed for the first time. The effect of key parameters, such as LED powers, ambient temperatures outside the headlamp, chamber configurations with and without inner lens, and heat sink (HS) sizes, is examined. As a result, a correlation between the mean air temperature (MAT) and the key parameters is essentially revealed. Variation of MAT with the LED power supply obeys the power law regardless of the presence of the inner lens. Moreover, it is also extremely complicated and depends on many effects. The thermal resistance decreases with increasing the HS size or decreasing the volume ratio of the housing chamber to HS (Vr). A significant reduction in thermal resistance and MAT per unit of HS area is up to 67.7 % and 74 % when Vr is reduced from 64.5 to 15.8, respectively. Based on these results, a new approach to thermal management of an enclosed chamber can be developed prospectively by defining the ambient temperature as MAT.
Original languageEnglish (US)
Pages (from-to)119846
JournalAPPLIED THERMAL ENGINEERING
Volume221
DOIs
StatePublished - Dec 17 2022

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