TY - JOUR
T1 - Fabrication and characterization of high-mobility solution-based chalcogenide thin-film transistors
AU - Mejia, Israel I.
AU - Salas Villaseñor, Ana L.
AU - Cha, Dong Kyu
AU - Alshareef, Husam N.
AU - Gnade, Bruce E.
AU - Quevedo-López, Manuel Angel Quevedo
N1 - KAUST Repository Item: Exported on 2020-10-01
Acknowledgements: This work was supported in part by the CONACyT, by the Air Force Office of Sponsored Research, and by the Army Research Laboratory. The review of this paper was arranged by Editor H.-S. Tae.
PY - 2013/1
Y1 - 2013/1
N2 - We report device and material considerations for the fabrication of high-mobility thin-film transistors (TFTs) compatible with large-area and inexpensive processes. In particular, this paper reports photolithographically defined n-type TFTs (n-TFTs) based on cadmium sulfide (CdS) films deposited using solution-based techniques. The integration process consists of four mask levels with a maximum processing temperature of 100 °C. The TFT performance was analyzed in terms of the CdS semiconductor thickness and as a function of postdeposition annealing in a reducing ambient. The IonI off ratios are ∼107 with field-effect mobilities of ∼5.3 and ∼4.7cm2V̇s for Al and Au source-drain contacts, respectively, using 70 nm of CdS. Transmission electron microscopy and electron energy loss spectroscopy were used to analyze the CdS-metal interfaces. © 1963-2012 IEEE.
AB - We report device and material considerations for the fabrication of high-mobility thin-film transistors (TFTs) compatible with large-area and inexpensive processes. In particular, this paper reports photolithographically defined n-type TFTs (n-TFTs) based on cadmium sulfide (CdS) films deposited using solution-based techniques. The integration process consists of four mask levels with a maximum processing temperature of 100 °C. The TFT performance was analyzed in terms of the CdS semiconductor thickness and as a function of postdeposition annealing in a reducing ambient. The IonI off ratios are ∼107 with field-effect mobilities of ∼5.3 and ∼4.7cm2V̇s for Al and Au source-drain contacts, respectively, using 70 nm of CdS. Transmission electron microscopy and electron energy loss spectroscopy were used to analyze the CdS-metal interfaces. © 1963-2012 IEEE.
UR - http://hdl.handle.net/10754/562575
UR - http://ieeexplore.ieee.org/document/6377280/
UR - http://www.scopus.com/inward/record.url?scp=84871801456&partnerID=8YFLogxK
U2 - 10.1109/TED.2012.2228200
DO - 10.1109/TED.2012.2228200
M3 - Article
SN - 0018-9383
VL - 60
SP - 327
EP - 332
JO - IEEE Transactions on Electron Devices
JF - IEEE Transactions on Electron Devices
IS - 1
ER -