Fabrication of Fully Inkjet-Printed Vias and SIW Structures on Thick Polymer Substrates

Sangkil Kim, Atif Shamim, Apostolos Georgiadis, Herve Aubert, Manos M. Tentzeris

Research output: Contribution to journalArticlepeer-review

43 Scopus citations


In this paper, a novel fully inkjet-printed via fabrication technology and various inkjet-printed substrate-integrated waveguide (SIW) structures on thick polymer substrates are presented. The electrical properties of polymethyl methacrylate (PMMA) are thoroughly studied up to 8 GHz utilizing the T-resonator method, and inkjet-printable silver nanoparticle ink on PMMA is characterized. A long via fabrication process up to 1 mm utilizing inkjet-printing technology is demonstrated, and its characteristics are presented for the first time. The inkjet-printed vias on 0.8-mm-thick substrate have a resistance of ∼ 0.2~ Ω . An equivalent circuit model of the inkjet-printed stepped vias is also discussed. An inkjet-printed microstrip-to-SIW interconnect and an SIW cavity resonator utilizing the proposed inkjet-printed via fabrication process are also presented. The design of the components and the fabrication steps are discussed, and the measured performances over the microwave frequency range of the prototypes are presented.
Original languageEnglish (US)
Pages (from-to)486-496
Number of pages11
JournalIEEE Transactions on Components, Packaging and Manufacturing Technology
Issue number3
StatePublished - Feb 11 2016


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