TY - GEN
T1 - FDM 3D printed coffee glove embedded with flexible electronic
AU - Bahri, Meznan
AU - Hussain, Muhammad Mustafa
AU - Brahimi, Tayeb
AU - Dahrouj, Hayssam
N1 - KAUST Repository Item: Exported on 2020-10-01
Acknowledgements: The present project was prepared under the collaboration of KAUST and the Electrical and Computer Engineering Department at Effat University. The authors gratefully acknowledge their support and express their deepest thanks to KAUST for arranging all facilities to complete this project.
PY - 2017/10/31
Y1 - 2017/10/31
N2 - With the advances in 3D printing technology, Flexible Electronics can now be exploited to form the so-called “Embedded Electronics”. This paper describes experiences learned from a research project which ran during summer 2016 at KAUST, in collaboration with the Electrical and Computer Engineering Department at Effat University, and aimed at creating a heating coffee glove product operating on double alkaline batteries using Kapton© as a flexible substrate for the circuit. The circuit and its batteries are encapsulated in a 3D printed glove, designed using SolidWorks©. The proposed methodology and techniques applied during this work could be further used in implementing other technologies, such as thermoelectric coolers head patches, smart garments, and flexible smartphones. Limitation and recommendation of the present methodology are also discussed.
AB - With the advances in 3D printing technology, Flexible Electronics can now be exploited to form the so-called “Embedded Electronics”. This paper describes experiences learned from a research project which ran during summer 2016 at KAUST, in collaboration with the Electrical and Computer Engineering Department at Effat University, and aimed at creating a heating coffee glove product operating on double alkaline batteries using Kapton© as a flexible substrate for the circuit. The circuit and its batteries are encapsulated in a 3D printed glove, designed using SolidWorks©. The proposed methodology and techniques applied during this work could be further used in implementing other technologies, such as thermoelectric coolers head patches, smart garments, and flexible smartphones. Limitation and recommendation of the present methodology are also discussed.
UR - http://hdl.handle.net/10754/626070
UR - http://ieeexplore.ieee.org/document/8088126/
UR - http://www.scopus.com/inward/record.url?scp=85040161266&partnerID=8YFLogxK
U2 - 10.1109/LT.2017.8088126
DO - 10.1109/LT.2017.8088126
M3 - Conference contribution
SN - 9781538635490
SP - 49
EP - 53
BT - 2017 Learning and Technology Conference (L&T) - The MakerSpace: from Imagining to Making!
PB - Institute of Electrical and Electronics Engineers (IEEE)
ER -