TY - JOUR
T1 - Fully inkjet-printed microwave passive electronics
AU - McKerricher, Garret
AU - Vaseem, Mohammad
AU - Shamim, Atif
N1 - KAUST Repository Item: Exported on 2020-10-01
Acknowledgements: Garret McKerricher and Dr Mohammad Vaseem contributed equally to this work. We acknowledge financial support from King Abdullah University of Science and Technology (KAUST) Office of Sponsored Research (OSR). For assistance and training with the Objet printer, we greatly appreciate the support of Rahman M. Hasan at the Visualization Facilities at KAUST. We would also like to thank Nini Wei, Long Chen and Shuai Yang for their work and assistance with SEM analysis of the films.
PY - 2017/1/30
Y1 - 2017/1/30
N2 - Fully inkjet-printed three-dimensional (3D) objects with integrated metal provide exciting possibilities for on-demand fabrication of radio frequency electronics such as inductors, capacitors, and filters. To date, there have been several reports of printed radio frequency components metallized via the use of plating solutions, sputtering, and low-conductivity pastes. These metallization techniques require rather complex fabrication, and do not provide an easily integrated or versatile process. This work utilizes a novel silver ink cured with a low-cost infrared lamp at only 80 °C, and achieves a high conductivity of 1×107 S m−1. By inkjet printing the infrared-cured silver together with a commercial 3D inkjet ultraviolet-cured acrylic dielectric, a multilayer process is demonstrated. By using a smoothing technique, both the conductive ink and dielectric provide surface roughness values of
AB - Fully inkjet-printed three-dimensional (3D) objects with integrated metal provide exciting possibilities for on-demand fabrication of radio frequency electronics such as inductors, capacitors, and filters. To date, there have been several reports of printed radio frequency components metallized via the use of plating solutions, sputtering, and low-conductivity pastes. These metallization techniques require rather complex fabrication, and do not provide an easily integrated or versatile process. This work utilizes a novel silver ink cured with a low-cost infrared lamp at only 80 °C, and achieves a high conductivity of 1×107 S m−1. By inkjet printing the infrared-cured silver together with a commercial 3D inkjet ultraviolet-cured acrylic dielectric, a multilayer process is demonstrated. By using a smoothing technique, both the conductive ink and dielectric provide surface roughness values of
UR - http://hdl.handle.net/10754/622837
UR - http://www.nature.com/articles/micronano201675
UR - http://www.scopus.com/inward/record.url?scp=85056297250&partnerID=8YFLogxK
U2 - 10.1038/micronano.2016.75
DO - 10.1038/micronano.2016.75
M3 - Article
C2 - 31057848
SN - 2055-7434
VL - 3
JO - Microsystems & Nanoengineering
JF - Microsystems & Nanoengineering
IS - 1
ER -