Fundamentals and improvements of diffusion barrier/copper adhesion for damascene process

L. J. Li^*, C. Y. Sheu, B. T. Chen, T. I. Bao, T. L. Lee, R. L. Hwang, S. M. Jang, C. H. Yu, M. S. Liang

^*Corresponding author for this work

Research output: Contribution to journal › Conference article › peer-review