High-Density Chemical Intercalation of Zero-Valent Copper into Bi 2 Se 3 Nanoribbons

Kristie J. Koski, Judy J. Cha, Bryan W. Reed, Colin D. Wessells, Desheng Kong, Yi Cui

Research output: Contribution to journalArticlepeer-review

158 Scopus citations

Abstract

A major goal of intercalation chemistry is to intercalate high densities of guest species without disrupting the host lattice. Many intercalant concentrations, however, are limited by the charge of the guest species. Here we have developed a general solution-based chemical method for intercalating extraordinarily high densities of zero-valent copper metal into layered Bi 2Se 3 nanoribbons. Up to 60 atom % copper (Cu 7.5Bi 2Se 3) can be intercalated with no disruption to the host lattice using a solution disproportionation redox reaction. © 2012 American Chemical Society.
Original languageEnglish (US)
Pages (from-to)7584-7587
Number of pages4
JournalJournal of the American Chemical Society
Volume134
Issue number18
DOIs
StatePublished - Apr 30 2012
Externally publishedYes

Fingerprint

Dive into the research topics of 'High-Density Chemical Intercalation of Zero-Valent Copper into Bi 2 Se 3 Nanoribbons'. Together they form a unique fingerprint.

Cite this