High-Density FeFET-based CAM Cell Design Via Multi-Dimensional Encoding

Hadi Noureddine, Omar Bekdache, Mohamad Al Tawil, Rouwaida Kanj, Ali Chehab, Mohamed E. Fouda, Ahmed Eltawil

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Content addressable memory is one of the most frequently used technologies in Data-centric applications due to its exceptional search parallelism capability. SRAM cells were initially used to implement CAM designs. Recent innovations proposed using compact nonvolatile memories instead. FeFETs emerged as a multi-level NVM device with promising potential and 2T FeFET CAM designs were studied. In this paper, a new potential is discussed for increasing the density efficiency of FeFET CAM architectures by adapting higher-dimensional encoding using 3T and 4T CAM designs. We propose a scalable greedy search algorithm for maximizing encoding capabilities. We compare the density, latency, accuracy, and energy consumption of our designs to standard 2T architecture demonstrating a 4x and 8x decrease in fail probability with up to 16% and 26.5% increase in memory density (bits/unit-area) in the 3T and 4T designs respectively.
Original languageEnglish (US)
Title of host publicationProceedings of the Great Lakes Symposium on VLSI 2023
PublisherACM
DOIs
StatePublished - Jun 5 2023

Fingerprint

Dive into the research topics of 'High-Density FeFET-based CAM Cell Design Via Multi-Dimensional Encoding'. Together they form a unique fingerprint.

Cite this