High-temperature operation of Al2O3/Ga2O3 bi-layer gate stack GaN MOS-HEMT up to 450 °C with suppressed gate leakage

Mritunjay Kumar*, Vishal Khandelwal, Saravanan Yuvaraja, Dhanu Chettri, Haicheng Cao, Ganesh Mainali, Xiao Tang, Xiaohang Li*

*Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

3 Scopus citations

Abstract

In this work, we report the reduced gate leakage current by using aluminum oxide (Al2O3) and gallium oxide (Ga2O3) as a bi-layer gate stack for GaN MOS-HEMT on a silicon substrate up to 450 °C. The bi-layer gate stack MOS-HEMTs suppressed the gate leakage by more than four orders of magnitude compared to only Al2O3-based GaN MOS-HEMT at 450 °C. The low gate leakage current is attributed to the reduced oxygen vacancies present in the Ga2O3 layer, which effectively impede the conduction path of the Poole-Frenkel emission at high temperatures, thereby enhancing the overall performance of GaN HEMTs.

Original languageEnglish (US)
Article number100905
JournalJapanese Journal of Applied Physics, Part 1: Regular Papers and Short Notes and Review Papers
Volume63
Issue number10
DOIs
StatePublished - Oct 1 2024

Keywords

  • gallium nitride
  • gate leakage current
  • gate stack
  • high electron mobility transistors
  • high temperature

ASJC Scopus subject areas

  • General Engineering
  • General Physics and Astronomy

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