Abstract
In this work, we report the reduced gate leakage current by using aluminum oxide (Al2O3) and gallium oxide (Ga2O3) as a bi-layer gate stack for GaN MOS-HEMT on a silicon substrate up to 450 °C. The bi-layer gate stack MOS-HEMTs suppressed the gate leakage by more than four orders of magnitude compared to only Al2O3-based GaN MOS-HEMT at 450 °C. The low gate leakage current is attributed to the reduced oxygen vacancies present in the Ga2O3 layer, which effectively impede the conduction path of the Poole-Frenkel emission at high temperatures, thereby enhancing the overall performance of GaN HEMTs.
Original language | English (US) |
---|---|
Article number | 100905 |
Journal | Japanese Journal of Applied Physics, Part 1: Regular Papers and Short Notes and Review Papers |
Volume | 63 |
Issue number | 10 |
DOIs | |
State | Published - Oct 1 2024 |
Keywords
- gallium nitride
- gate leakage current
- gate stack
- high electron mobility transistors
- high temperature
ASJC Scopus subject areas
- General Engineering
- General Physics and Astronomy