TY - JOUR
T1 - Highly Efficient Full-Color Inorganic LEDs on a Single Wafer by Using Multiple Adhesive Bonding
AU - Mun, Seung-Hyun
AU - Kang, Chang-Mo
AU - Min, Jung-Hong
AU - Choi, Soo-Young
AU - Jeong, Woo-Lim
AU - Kim, Gi-Gwan
AU - Lee, Je-Sung
AU - Kim, Kyung-Pil
AU - Ko, Heung Cho
AU - Lee, Dong-Seon
N1 - KAUST Repository Item: Exported on 2021-06-30
Acknowledgements: This work was supported by the Technology Innovation program (20004946) funded by Ministry of Trade, Industry and Energy (MOTIE, Korea) and Samsung Electronics.
PY - 2021/6/27
Y1 - 2021/6/27
N2 - Monolithic integration is a promising way to realize full-color high-resolution displays. However, it is still a challenge to realize a highly efficient full-color light-emitting diode (LED) adopting color conversion layer. In this work, red, green, and blue inorganic LED thin films grown on respective substrates for high-quality epitaxial layers are integrated on a single substrate using a multiple adhesive bonding technique. It is verified that the stacked thin films are structurally stable. After the multiple bonding, respective subpixels are formed by using standard photolithography only without a mass transfer process, showing the possibility of applying them to a high-resolution micro-LED display. Even after the bonding, the device still maintains high efficiency without deteriorating performance. The integrated subpixels are not only independently operated by controlling input power, but the light emission can also cover a wide range of the color space, about 83% compared to Rec.2020 color space.
AB - Monolithic integration is a promising way to realize full-color high-resolution displays. However, it is still a challenge to realize a highly efficient full-color light-emitting diode (LED) adopting color conversion layer. In this work, red, green, and blue inorganic LED thin films grown on respective substrates for high-quality epitaxial layers are integrated on a single substrate using a multiple adhesive bonding technique. It is verified that the stacked thin films are structurally stable. After the multiple bonding, respective subpixels are formed by using standard photolithography only without a mass transfer process, showing the possibility of applying them to a high-resolution micro-LED display. Even after the bonding, the device still maintains high efficiency without deteriorating performance. The integrated subpixels are not only independently operated by controlling input power, but the light emission can also cover a wide range of the color space, about 83% compared to Rec.2020 color space.
UR - http://hdl.handle.net/10754/669811
UR - https://onlinelibrary.wiley.com/doi/10.1002/admi.202100300
U2 - 10.1002/admi.202100300
DO - 10.1002/admi.202100300
M3 - Article
SN - 2196-7350
SP - 2100300
JO - Advanced Materials Interfaces
JF - Advanced Materials Interfaces
ER -