TY - JOUR
T1 - Highly Manufacturable Deep (Sub-Millimeter) Etching Enabled High Aspect Ratio Complex Geometry Lego-Like Silicon Electronics
AU - Ghoneim, Mohamed T.
AU - Hussain, Muhammad Mustafa
N1 - KAUST Repository Item: Exported on 2020-10-01
Acknowledgements: This publication is based upon work supported by the King Abdullah University of Science and Technology (KAUST).
PY - 2017/2/1
Y1 - 2017/2/1
N2 - A highly manufacturable deep reactive ion etching based process involving a hybrid soft/hard mask process technology shows high aspect ratio complex geometry Lego-like silicon electronics formation enabling free-form (physically flexible, stretchable, and reconfigurable) electronic systems.
AB - A highly manufacturable deep reactive ion etching based process involving a hybrid soft/hard mask process technology shows high aspect ratio complex geometry Lego-like silicon electronics formation enabling free-form (physically flexible, stretchable, and reconfigurable) electronic systems.
UR - http://hdl.handle.net/10754/622865
UR - http://onlinelibrary.wiley.com/doi/10.1002/smll.201601801/abstract
UR - http://www.scopus.com/inward/record.url?scp=85011681297&partnerID=8YFLogxK
U2 - 10.1002/smll.201601801
DO - 10.1002/smll.201601801
M3 - Article
C2 - 28145623
SN - 1613-6810
VL - 13
SP - 1601801
JO - Small
JF - Small
IS - 16
ER -