TY - GEN
T1 - Impedimetric Plant Biosensor Based on Minimally Invasive and Flexible Microneedle Electrodes
AU - Bukhamsin, Abdullah
AU - Moussi, Khalil
AU - Patel, Niketan Sarabhai
AU - Przybysz, Alexander
AU - Wang, Yajun
AU - Krattinger, Simon G.
AU - Kosel, Jürgen
N1 - KAUST Repository Item: Exported on 2020-10-01
PY - 2020/4/7
Y1 - 2020/4/7
N2 - This paper presents an impedimetric biosensor for monitoring of crops using novel microneedle electrodes for minimally invasive, sensitive measurements, compatible with smart agriculture developments. The biosensor was fabricated through polydimethylsiloxane imprinting using a high-resolution 3D printed negative mold. This method allows for fabrication of tailored microneedles with heights up to 500μm, required to penetrate through the epidermis of a leaf. The sensor was tested by recording the bioimpedance of Barely leaves and comparing its performance to conventional planar and needle electrodes. Furthermore, we present evidence of a diurnal pattern in plant bioimpedance that was detected by monitoring the leaf bioimpedance under controlled conditions.
AB - This paper presents an impedimetric biosensor for monitoring of crops using novel microneedle electrodes for minimally invasive, sensitive measurements, compatible with smart agriculture developments. The biosensor was fabricated through polydimethylsiloxane imprinting using a high-resolution 3D printed negative mold. This method allows for fabrication of tailored microneedles with heights up to 500μm, required to penetrate through the epidermis of a leaf. The sensor was tested by recording the bioimpedance of Barely leaves and comparing its performance to conventional planar and needle electrodes. Furthermore, we present evidence of a diurnal pattern in plant bioimpedance that was detected by monitoring the leaf bioimpedance under controlled conditions.
UR - http://hdl.handle.net/10754/662622
UR - https://ieeexplore.ieee.org/document/9056158/
UR - http://www.scopus.com/inward/record.url?scp=85083193100&partnerID=8YFLogxK
U2 - 10.1109/MEMS46641.2020.9056158
DO - 10.1109/MEMS46641.2020.9056158
M3 - Conference contribution
SN - 9781728135809
SP - 307
EP - 310
BT - 2020 IEEE 33rd International Conference on Micro Electro Mechanical Systems (MEMS)
PB - IEEE
ER -