Improving adhesion of copper/epoxy joints by pulsed laser ablation

Engineering

• Pulsed Laser Ablation 100%
• Joints (Structural Components) 100%
• Pretreatment 50%
• Finite Element Simulation 50%
• Fracture Surface 50%
• Mechanical Performance 50%
• Control Sample 50%
• Cohesive Failure 50%
• Ablation Process 50%
• Peel Energy 50%
• Test Coupon 50%
• Copper Substrate 50%
• Fibre Laser 50%
• T-Peel Test 50%
• Laser Beam 50%
• Surface Asperity 50%
• Adhesive Layer 50%
• Ray Photoelectron Spectroscopy 50%
• Cohesive Zone Model 50%
• Surface Morphology 50%

Keyphrases

• Laser Ablation Method 50%
• Adhesive Layer 50%
• Mechanical Interlocking 50%
• T-peel Test 50%
• Yb-doped Fiber Laser 50%
• Copper Substrate 50%
• Adhesive Penetration 50%
• Surface Asperity 50%