In-plane and out-of-plane structural response of spiral interconnects for highly stretchable electronics

Engineering

• Prescribed Displacement 100%
• Interconnects 100%
• Strain 100%
• Structural Response 100%
• Numerical Calculation 50%
• Experimental Result 50%
• Tensiles 50%
• Principal Strain 50%
• Angular Position 50%
• 3D Printing 50%
• Strain State 50%
• Generated Stress 50%
• Plane Case 50%
• Demonstrates 50%
• Numerical Modeling 50%

Keyphrases

• Triangular Configuration 100%
• Spiral Configuration 66%
• Stress-strain State 33%
• Interconnection Architectures 33%
• Island System 33%
• Von Mises Stress 33%

Material Science

• Three Dimensional Printing 100%